Hong Kong Science and Technology Parks Corporation (HKSTP), and Fujitsu Microelectronics Limited’s (FML) subsidiary e-Shuttle Inc. (ESI) in Japan have signed an agreement to provide silicon shuttle services for start-up integrated circuit (IC) design houses in Asia.
The initiative, boosting Asia’s semiconductor industry, provides first-of-a-kind Electron Beam Direct Writing (EBDW) technology at low cost. The proprietary EBDW technology developed by e-Shuttle significantly lowers the cost of prototyping ICs and reduces turnaround time.
